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https://www.researchgate.net/publication/226225629_Thermal_and_Power_Delivery_Challenges_in_3D_ICs
Second, the power to be delivered to a 3D chip, per package pin, is tremendously increased, leading to significant complications in the task of reliable power delivery.
https://www.researchgate.net/profile/Pingqiang_Zhou/publication/226225629_Thermal_and_Power_Delivery_Challenges_in_3D_ICs/links/02bfe510afb94c9bb0000000.pdf
3 Thermal and Power Delivery Challenges in 3D ICs 35 material (in kg/m3). This may be rewritten as the following heat equation, which is a parabolic PDE: ρcp ∂T(r,t) ∂t = kt∇2T(r,t)+g(r,t ...
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