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https://www.academia.edu/707632/Power_delivery_design_for_3-D_ICs_using_different_through-silicon_via_TSV_technologies
Power delivery design for 3-D ICs using different through-silicon via (TSV) technologies
https://www.researchgate.net/publication/224123499_Power_Delivery_Design_for_3-D_ICs_Using_Different_Through-Silicon_Via_TSV_Technologies
Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies Article (PDF Available) in IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19(4):647 - 658 ...
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