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http://www.ti.com/lit/an/swpa222a/swpa222a.pdf
Power Delivery Network Analysis 5. TI specifies in the Data Manual (DM) a board DC resistance budget, from VRM to OMAP balls for critical power nets. Due to the shape geometry complexity, vias and multilayer’s used during the net routing, it is difficult to calculate manually the DC resistance.
https://resources.altium.com/pcb-design-blog/power-delivery-network-analysis-pcd-design
May 02, 2017 · Power delivery network analysis software can bring all the knowledge of a power professional right to your personal computer. A good analysis program will help you check current densities, possible temperature problems, and voltage drops …Author: Altium Designer
https://fhi.nl/app/uploads/sites/56/2017/08/CB-DISTR.pdf
Erik Nijeboer / Bram Bruekers Oktober 2017 Power Delivery Network Analysis
https://www.swtest.org/swtw_library/2011proc/PDF/S03_04_Hohenwarter_SWTW2011.pdf
Power Delivery Network Analysis ‐a case for true 3D simulations Gert Hohenwarter GateWave Northern, Inc.
https://ieeexplore.ieee.org/document/8654735/
System-Level Power Delivery Network Analysis and Optimization for Monolithic 3-D ICs Abstract: As 2-D scaling reaches its limit, monolithic 3-D (M3D) IC is a leading contender for continuing equivalent scaling.Author: Kyungwook Chang, Shidhartha Das, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim
https://c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2017/12/Core-Power-Delivery-Network-Analysis-of-Core-and-Coreless-Substrates-in-a-Multilayer-Organic-Buildup-Package-White-Paper-0714.pdf
DC Voltage of 1.1 V is applied at the package balls. A 3D commercial software tool such as Cadence Speed2000 is used for this simulation. A total of 374 die side power and ground bumps as well 59 BGA side power and ground balls are lumped together in the simulation environment for the time domain analysis.
http://www.gtcad.gatech.edu/www/papers/08654735.pdf
System-Level Power Delivery Network Analysis and Optimization for Monolithic 3-D ICs Kyungwook Chang , Shidhartha Das, Saurabh Sinha, Brian Cline, Greg Yeric, and Sung Kyu Lim, Senior Member, IEEE Abstract—As 2-D scaling reaches its limit, monolithic 3-D (M3D) IC is a leading contender for continuing equivalent scaling.
https://www.flowcad.de/datasheets/Allegro_PDN_Datasheet.pdf
Power delivery network (PDN) analysis is a critical component of contempo- rary PCB design. Higher frequency designs being powered by lower volt- ages leaves little margin for IR drop or ground bounce.File Size: 605KB
https://www.cadence.com/content/cadence-www/global/en_US/home/tools/pcb-design-and-analysis/pc-design-flows/power-delivery-network-pdn.html
In addition, there are the power delivery network (PDN) challenges for a PCB designer, starting with the multiple instructions from hardware designer or power integrity (PI) engineer that are communicated by email, phone call, rules of thumb, etc. The designer must apply all of those instructions and rules to multiple power supplies.
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