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https://dl.acm.org/citation.cfm?doid=1393921.1393985
Robust power delivery is considered one the prime challenges in chip design today. As the frequency and complexity of microprocessors increase, the static and dynamic components of power supply noise increase. However, keeping with Moore's law, the voltage supply to semiconductor chips have been scaling down, thereby reducing margins.Author: Srikanth Balasubramanian
https://www.researchgate.net/publication/285623507_Power_Delivery_for_High-Performance_Microprocessors
In order to study this problem, we propose a fine-grain, parameterizable model for power-delivery networks that allows system designers to study localized, on-chip supply fluctuations in high ...Author: Kemal Aygun
https://ieeexplore.ieee.org/document/4195709/
Abstract: Conventional power delivery methods for microprocessors and high-performance ASICs have fundamental limitations in meeting the power requirements of future IC technologies due to large interconnect parasitics. A new three-dimensional (3D) power delivery approach along with a cellular power supply architecture is proposed as a possible solution to the problems of conventional 2D power delivery.
https://www.semanticscholar.org/paper/Power-delivery-for-high-performance-microprocessors-Balasubramanian/fe299eecf739e0c0367f40414f54cfb976a259e4
Summary form only given. Robust power delivery is considered one the prime challenges in chip design today. As the frequency and complexity of microprocessors increase, the static and dynamic components of power supply noise increase.
https://dl.acm.org/doi/10.1145/2463209.2488931
Home Conferences DAC Proceedings DAC '13 Power management and delivery for high-performance microprocessors. research-article . Free Access. Power management and delivery for high-performance microprocessors. Share on. Authors: Tanay Karnik. Intel® Corporation, Hillsboro, OR. Intel® Corporation, Hillsboro, OR.
https://www.infona.pl/resource/bwmeta1.element.ieee-art-000004195709
Conventional power delivery methods for microprocessors and high-performance ASICs have fundamental limitations in meeting the power requirements of future IC technologies due to large interconnect parasitics. A new three-dimensional (3D) power delivery approach along with a cellular power supply architecture is proposed as a possible solution to the problems of conventional 2D power delivery ...
https://www.researchgate.net/publication/224702695_3D_Power_Delivery_for_Microprocessors_and_High-Performance_ASICs
Conventional power delivery methods for microprocessors and high-performance ASICs have fundamental limitations in meeting the power requirements of future IC technologies due to large ...
https://www.deepdyve.com/lp/association-for-computing-machinery/power-delivery-for-high-performance-microprocessors-VyB1rSyn8U
Aug 11, 2008 · Power delivery for high performance microprocessors Power delivery for high performance microprocessors Balasubramanian, Srikanth 2008-08-11 00:00:00 Power Delivery for High Performance Microprocessors Srikanth Balasubramanian Intel Corporation 136, Airport Road, Bangalore - India [email protected] Abstract Robust power delivery is considered one the prime challenges in chip design today. As the frequency and complexity of microprocessors …
http://pwrsocevents.com/wp-content/uploads/2008-presentations/Invited%20Talk%20S1x4%20-%20J.%20Ted%20Dibene%20-%20Integrated%20Power%20Delivery%20for%20High%20Performance%20Server%20Based%20Microprocessors.pdf
MCP Power Delivery •To combat the emerging issues of multi-core, power delivery must get closer to the load. This requires delivery on package. •Many rails requires many VR’s •Reliability is key metric •Size is key metric •Cost is key metric. Slide 20 Example large die on package Example Power SOC Device next to die
http://citeseerx.ist.psu.edu/viewdoc/download?doi=10.1.1.421.8674&rep=rep1&type=pdf
power delivery have thus jumped to the forefront in the microprocessor industry. There is even concern that power consumption may set the limit to how much can be integrated on a chip, and how fast it can be clocked [5]. The challenges for power reduction in high-performance general-purpose CPUs are unique. First, the instruction-set and system
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